This list represents a glimpse into our collective future. https://t.co/BRPQSkjZ0t
— MIT Technology Review (@techreview) November 30, 2021
- SanDisk (SNDK) HBF Tapeout: The SLC Requirement Cuts the Capacity Claim and Quadruples NAND Bit Demand
- 30 Rock Was Shaped by How Far Daylight Travels; the Data Center Is Shaped by How Far Heat Does
- Why DRAM and HBM Demand Grows as AI Matures, and Where the Cycle Still Bites
- The AI Boom Is Broadening: Intel’s $100 Billion Book, CoreWeave’s 1.5 Gigawatts, and Gemini’s Billionth User
- Autodesk Opens Fusion to AI Agents as SendCutSend Banks $110 Million: The Design-to-Part Loop Is Now Machine-Readable
- Cloudflare Open-Sources Cloudflare OS: The Agent Workspace Is Free, the Network Underneath Is Not
- Marvell (MRVL) Turns Celestial AI Into Product, and the $5.5 Billion Earnout Clock Is Now Running
- Samsung Unveils zHBM and 400-Layer V10 BV-NAND at FMS 2026, and Wafer Bonding Is the Common Thread
- Kioxia GP1 Wins FMS Best of Show With 10 Million IOPS, Splitting From SanDisk and SK Hynix on HBF
- The Humanoid Robot Bottleneck Is the Battery: Why Two Kilowatt-Hours Caps the Whole Industry